Lorentz Solution Jointly Presents with NVIDIA on Automated Large-Scale Chip-Level 3D EM Extraction and Sign-off of Ultra-High-Speed Silicon Photonics and IC/3DIC Designs at 2026 TSMC OIP
Businesswire·2026-09-14 23:30公司动态 - Lorentz Solution与NVIDIA联合在TSMC 2026 OIP生态系统论坛上展示论文[1] - 论坛将于2026年9月23日在加州圣克拉拉举行[1] - 论文主题为“大规模芯片级3D电磁提取与超高速硅光子和定制硅IC/3DIC设计的签核”[1] 技术产品 - Lorentz Solution是全球领先的3D电磁设计平台提供商[1] - 其平台覆盖IC、3DIC和先进封装领域[1] - 论文中提及使用PeakView®工具进行设计[1]