Novel multi-die packaging platform enables multi-die architectures with lower power consumption and reduced total cost  Industry-first modular RDL interposer offers an alternative to traditional silicon interposers and enables supply chain flexibility for data center infrastructure Solution is production-qualified and now entering production ramp in support of customer-specific AI accelerator designsSANTA CLARA, Calif., May 29, 2025 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data ...