Key Takeaways Lam Research's packaging-related revenue topped $1B in 2024, with AI fueling 3D architecture demand.New TEOS 3D deposits thick dielectric films, offering faster throughput and lower ownership costs.Combined with SABRE 3D, TEOS 3D strengthens LRCX's portfolio as chiplet adoption accelerates.Lam Research (LRCX) is putting more focus on advanced packaging as demand for AI chips grows. In the fourth quarter of fiscal 2025, management noted that demand for AI chips is pushing the industry toward mo ...