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台湾科技峰会_原始设计制造商、印刷电路板与液冷_微通道盖-APAC Technology Taiwan Summit Hardware Day 2 themes_ ODMs, PCB & Liquid Cooling _ Micro Channel Lids
2025-09-22 09:00

Key highlights from the hardware meetings: 1) Wistron is seeing bottoming in August and strong ramp in Q4 into 2026, also with a good rebound in margins along with better notebook demand, 2) AVC and Auras are seeing strong ramps of cold plates through H225 into 2026 at both GPU and ASIC servers. Rubin qualifications are in discussion between using cold plate vs. micro-channel lid (MCL) in the coming 1-2 months. Cold plate suppliers see merits to improving the design and seeing MCL only from Rubin Ultra or f ...