OTTAWA, Ontario, April 14, 2025 (GLOBE NEWSWIRE) -- TechInsights today released early-stage findings of its teardown analysis of the NVIDIA Blackwell HGX B200 platform delivering advanced artificial intelligence (AI) and high-performance computing (HPC) performance in the data center. TechInsights reports SK hynix is the high-bandwidth memory (HBM3E) supplier and the GB100 graphics processing unit (GPU) implements TSMC’s latest advanced packaging architecture. “Our analysts, technicians, and engineers have ...