SK hynix Showcases Next Generation AI Memory Innovation at CES 2026
SK hynix to operate customer exhibition booth to enhance customer connection Unveils 16-layer HBM4 with 48GB for the first time and showcases conventional and AI focused products such as SOCAMM2 and LPDDR6 With 'AI System Demo Zone', visualizes custom HBM structure to present future technology Company to create new value based on differentiated memory solution and close collaboration with customers SEOUL, South Korea, Jan. 5, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announ ...