Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs
是德科技是德科技(US:KEYS) Businesswire·2026-02-18 00:00

公司产品发布 - 公司发布了一款解决方案,旨在通过自动化复杂工作流程来解决设计瓶颈问题 [1]

Keysight Technologies-Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs - Reportify