VANCOUVER, British Columbia, Sept. 16, 2025 (GLOBE NEWSWIRE) -- Highland Copper Company Inc. (TSXV: HI; OTCQB: HDRSF) (“Highland” or the “Company”) is pleased to announce it has received a non-binding Letter of Interest (“LOI”) from the Export-Import Bank of the United States (“EXIM”) for potential debt financing of up to US$250 million to support development of its fully permitted Copperwood Project in the Upper Peninsula of Michigan. The LOI was issued under EXIM’s Make More in America Initiative and may ...