The European Commission (EC) has approved a €450m ($518m) subsidy from the Czech government for onsemi to establish a new silicon carbide (SiC) semiconductor fabrication facility in Rožnov pod Radhoštěm, Czechia. The funding forms part of the US-based chip manufacturer’s planned €1.64bn investment and is expected to enable the completion of the plant by 2027. Upon completion, the Rožnov pod Radhoštěm plant is expected to become the first integrated SiC device manufacturing site of its kind in the Europea ...