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共封装光学器件(CPO) -点亮人工智能加速之路-Global IO Semiconductor APAC Focus Co-packaged optics—lighting the path to AI acceleration
台积公司台积公司(US:TSM)2025-07-24 13:04

ab 22 July 2025 Global Research UBS Global I/O Semiconductors APAC Focus: Co-packaged optics—lighting the path to AI acceleration Co-packaged optics (CPO) is essential for next gen AI servers to support higher interconnect bandwidth and reasonable power consumption. We have looked in detail at the transition to this technology and the implications across the supply chain. We expect meaningful commercialisation when AI data centre switches migrate to the 3.2T/port era in 2027-28E, followed by integration wit ...