DDR5 12.8Gbps MRDIMM Gen2 memory IP system solution

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Cadence and TSMC Strengthen Partnership to Enhance AI & 3D-IC Designs
ZACKS· 2025-04-25 22:35
公司与台积电合作扩展 - 公司与台积电(TSMC)扩大长期合作,加速先进节点和3D-IC技术的硅片开发时间,涵盖N2P、N3和N5工艺技术 [1] - 合作内容包括认证设计流程、硅验证IP及持续技术协作,支持台积电N2P、A16节点,并为A14节点提供路径 [2] - 公司深化对台积电3DFabric技术的支持,扩展工具认证至N3C工艺,并基于N3P设计解决方案 [2] AI驱动设计与工具认证 - 公司提供AI驱动的设计解决方案,覆盖chiplet、SoC、先进封装及3D-IC,作为台积电N2P、N3和N5平台的关键IP提供商 [2] - 数字、定制/模拟及热分析工具已获N2P和A16节点认证,并集成大语言模型(LLM)以提升未来节点的自动化与效率 [3] - 公司推出行业首款DDR5 12.8Gbps MRDIMM Gen2内存IP系统解决方案,基于台积电N3工艺节点,满足AI、ML、HPC及企业数据处理需求 [8] 3D-IC技术与IP组合 - 公司为台积电3DFabric提供完整chiplet设计与封装方案,扩展AI训练应用的IP组合,包括HBM3E 9.6G(N5/N4P)、预硅HBM3E 10.4G(N3P)及UCIe 16G N3P解决方案 [4] - Integrity 3D-IC平台增强结果质量(QoR),支持3Dblox参考流程、芯片-封装协同设计及多物理场分析,新增AI驱动的规划与优化功能 [5] - Sigrity X技术与Clarity 3D求解器集成,实现3Dblox信号与电源完整性(SIPI)合规自动化,简化UCIe和HBM通道的S参数提取与时域分析 [6] 先进节点与技术创新 - 公司通过Virtuoso Studio平台简化模拟/RF设计迁移,加速先进及RF节点开发,并支持台积电紧凑通用光子引擎(COUPE)及GPU加速的云端设计流程 [7] - EMX Planar 3D求解器已获N3节点认证,并正在进行N2P认证以满足先进节点IC需求 [6] 行业表现与对比 - 公司股票在过去6个月上涨11.5%,同期Zacks计算机-软件行业下跌8.4% [9] - 行业其他表现优异股票包括ACI Worldwide(ACIW,Zacks排名1,过去一年涨58.2%)、SAP SE(SAP,Zacks排名1,过去一年涨46.9%)及Dassault Systemes(DASTY,Zacks排名2,过去6个月涨6.4%) [11][12][13][14]
Cadence Set to Release Q1 Earnings: Here's What to Expect
ZACKS· 2025-04-25 19:50
Cadence Design Systems, Inc (CDNS) is scheduled to release first-quarter 2025 results on April 28.The Zacks Consensus Estimate for first-quarter 2025 earnings has been unchanged in the past 60 days at $1.49 per share. The consensus mark implies an increase of 27.4% from the year-ago actual. The Zacks Consensus Estimate for revenues is pegged at $1.24 billion, indicating a 22.7% uptick from the year-ago actual.For the first quarter of 2025, CDNS expects revenues to be in the $1.23-$1.25 billion band. The com ...
CDNS Powers AI Memory With Industry-First DDR5 12.8Gbps MRDIMM Gen2 IP
ZACKS· 2025-04-22 22:20
Cadence Design Systems, Inc. (CDNS) recently launched the industry's first DDR5 12.8Gbps MRDIMM Gen2 memory IP system solution, designed on the advanced TSMC N3 process node. This leading-edge memory solution is poised to address the skyrocketing demand for memory bandwidth fueled by the explosion of artificial intelligence (AI), machine learning (ML), high-performance computing (HPC) and enterprise data processing workloads. Delivering a robust 12.8Gbps data rate, it effectively doubles the bandwidth of st ...