LOS ANGELES--(BUSINESS WIRE)--The Schall Law Firm, a national shareholder rights litigation firm, reminds investors of a class action lawsuit against Synopsys, Inc. ("Synopsys†or "the Company†) (NASDAQ: SNPS) for violations of §§10(b) and 20(a) of the Securities Exchange Act of 1934 and Rule 10b-5 promulgated thereunder by the U.S. Securities and Exchange Commission. Investors who purchased the Company's securities between December 4, 2024 and September 9, 2025, inclusive (the "Class Period†), are encou ...

NEW YORK, Nov. 03, 2025 (GLOBE NEWSWIRE) -- Leading securities law firm Bleichmar Fonti & Auld LLP announces that a class action lawsuit has been filed against Synopsys, Inc. (NASDAQ: SNPS) and certain of the Company’s senior executives for securities fraud after a significant stock drop resulting from the potential violations of the federal securities laws. If you invested in Synopsys, you are encouraged to obtain additional information by visiting: https://www.bfalaw.com/cases/synopsys-inc. Investors have ...

公司财务表现 - 公司2025年第三季度营收为17.40亿美元，低于此前17.55亿至17.85亿美元的指引区间[5] - 公司2025年第三季度净利润为2.425亿美元，较2024年同期的4.259亿美元同比下降43%[5] - 设计IP业务部门营收为4.266亿美元，同比下降7.7%，占公司总营收约25%[5] - 管理层指引暗示2025财年设计IP业务营收将至少下降5%[5] 公司股价影响 - 公司股价在2025年9月10日下跌216.59美元，跌幅达35.8%，收盘报387.78美元，当日交易量异常放大[6] 法律诉讼指控 - 指控公司及其高管通过发布虚假和/或误导性陈述，未能披露其对人工智能客户的过度关注正在损害其设计IP业务的经济效益[4] - 指控公司某些路线图和资源决策不太可能产生预期结果，并对财务业绩产生重大负面影响[4] - 指控公司关于业务、运营和前景的正面陈述因此缺乏合理基础且具有重大误导性[4] 法律程序信息 - 投资者申请成为集体诉讼首席原告的截止日期为2025年12月30日[2] - 律师事务所正在调查在2024年12月4日至2025年9月9日期间损失超过10万美元的投资者情况[1]

BENSALEM, Pa.--(BUSINESS WIRE)--Law Offices of Howard G. Smith announces that a class action lawsuit has been filed on behalf of investors who purchased Synopsys, Inc. ("Synopsys†or the "Company†) (NASDAQ: SNPS) securities between December 4, 2024 and September 9, 2025, inclusive (the "Class Period†). Synopsys investors have until December 30, 2025 to file a lead plaintiff motion. IF YOU ARE AN INVESTOR WHO SUFFERED A LOSS IN SYNOPSYS, INC. (SNPS), CONTACT THE LAW OFFICES OF HOWARD G. SMITH TO. ...

ATLANTA, Nov. 03, 2025 (GLOBE NEWSWIRE) -- A shareholder class action lawsuit has been filed against Synopsys, Inc. (“Synopsys” or the “Company”) (NASDAQ: SNPS). The lawsuit alleges that Defendants made materially false and/or misleading statements and/or failed to disclose material adverse information, including allegations that: (i) the extent to which Synopsys’ increased focus on artificial intelligence customers, which require additional customization, was deteriorating the economics of its Design IP bu ...

Bragar Eagel & Squire, P.C. Litigation Partner Brandon Walker Encourages Investors Who Suffered Losses In Synopsys To Contact Him Directly To Discuss Their Options If you purchased or acquired Synopsys securities between December 4, 2024 and September 9, 2025 and would like to discuss your legal rights, call Bragar Eagel & Squire partner Brandon Walker or Marion Passmore directly at (212) 355-4648. Click here to participate in the action. NEW YORK, Nov. 03, 2025 (GLOBE NEWSWIRE) -- What’s Happening: Bragar ...

多芯片组件中的应力挑战 - 管理多芯片组件中的热应力和机械应力需要详细了解器件的使用方式、封装方式以及应力在预期寿命内可能导致的问题，包括工作负载相关的热梯度、机械和电应力，这些因素会因电迁移和介电击穿等老化效应而加剧 [2] - 最先进GPU运行功率约为500瓦，但人工智能应用中晶体管利用率提高可能使功率攀升至1000瓦/平方厘米，导致散热困难并引发机械变形，如翘曲、开裂和分层 [2] - 热建模和管理过去是分开的任务，但在多芯片组件中需要一起解决 [2] 应力来源与相互依存性 - 多芯片系统中的机械应力和热应力相互依存，制造过程中的热循环会拉伸材料使整个系统产生应力，这种应力必须控制在极限范围内 [4] - 制造过程可用模型模拟，温度作为系统参数，从而构建动态应力模型以观察从步骤1到步骤100的系统应力行为演变 [4] - 代工厂开始关注应力数据并将其提供给EDA工具提供商，以PDK形式向设计团队提供 [4][5] 先进封装对散热的影响 - 3D堆叠技术使散热路径更加复杂，热量通过凸点互连传递，而这些互连并非专为散热设计，导致导热系数更高且变化幅度更大 [6] - 多芯片堆叠中不同层级可能出现新的热源，热量会级联扩散并相互影响，需要进行电热仿真同时考虑电路的电性能和热性能 [7] - 简单的经验法则和基础数学计算不再适用于模拟芯片的热应力，需要从代工厂获取更多数据，如多种IC和封装技术的热堆叠结构和材料特性 [6][7] 热应力的系统性影响 - 热应力是系统性问题，从单个芯片扩散到其他芯片、封装、PCB和系统外壳，在3D集成电路中解决难度更大 [8] - 由于3D-IC技术单芯片功耗巨大，所有芯片设计公司必须在早期设计阶段进行热分析，以找到更有利于散热的系统架构 [8] - 热效应影响芯片键合，在3D集成电路中还存在热应力，需要进行热分析因为热应力可能对时序和功耗产生影响 [8] 3D-IC设计中的机械应力 - 3D芯片堆叠结构更容易产生机械应力，因为堆叠芯片之间存在不同的悬垂和下垂，连接芯片的硅通孔位置可能高达数千个，芯片厚度也有显著变化 [9] - 跨芯片边界的数据传输需避免引入瓶颈限制性能，又不能引入过多占用面积的硅通孔，需要感知多芯片的互连架构或片上网络IP设计工具进行权衡 [9] 应力对器件性能的影响 - 器件投入使用后不同芯片升温速率不同，对热量的响应也因材料和负载而异 [11] - 所有形式的应力都会影响器件性能，芯片堆叠中不同温度芯片因膨胀系数不同承受的应力也不同，这种应力加上温度影响会影响器件和芯片性能 [12] - 应力是影响器件性能的另一个因素，需要进行建模和仿真，但该领域仍处于研究阶段 [12] 应力缓解与工具发展 - EDA工具供应商正在添加考虑热效应和应力的布局、提取和多芯片签核流程，但严重依赖于精确的代工厂数据 [13] - 微流体冷却等新颖方法将去离子水泵入通孔结构内部的微型喷嘴和管道中，在发热源处主动排出热量，但给建模工作增加了流体流动等因素 [13] - 人工智能发挥越来越重要作用，新工具可自动生成应力感知测试平台、将RTL意图与物理效应关联，并提出可最小化芯片间应力的分区策略 [13] 设计流程的变革 - 芯片设计核心人员必须在整个设计过程中，甚至在布局规划的早期阶段就考虑散热问题，需要早期掌握可靠热数据以避免无法挽回的糟糕情况 [14] - 热分析成为设计流程的一部分而非最后时刻的检查，需要从代工厂获取更多数据，工具已经很成熟且运行良好 [14] - 芯片组情况更加复杂，相同芯片组封装到3D封装中表现可能不同，必须注意并采取保护措施确保它们处于需要的位置 [15]

Accessibility StatementSkip Navigation You can also contact attorneys J.C. Sanchez or Jennifer N. Caringal of Robbins Geller by calling 800/449- 4900 or via e-mail at [email protected]. Lead plaintiff motions for the Sypnosis class action lawsuit must be filed with the court no later than December 30, 2025, 2025. CASE ALLEGATIONS: Synopsys provides electronic design automation software products used to design and test integrated circuits. Synopsys operates in two segments, Design Automation and Design IP. ...

Oct 31, 2025 5:38 PM Eastern Daylight Time SNPS CLASS ACTION NOTICE: Glancy Prongay & Murray LLP Files Securities Fraud Lawsuit On Behalf Of Synopsys, Inc. Shareholders Share LOS ANGELES--(BUSINESS WIRE)--Glancy Prongay & Murray LLP ("GPM†), announces that it has filed a class action lawsuit in the United States District Court for the Northern District of California, captioned Kim v. Synopsis, Inc., et al., Case No. 3:25-cv-09410, on behalf of persons and entities that purchased or otherwise acquired Syno ...

Accessibility StatementSkip Navigation SUNNYVALE, Calif., Oct. 30, 2025 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced it will report results for the fourth quarter and fiscal year 2025 on Wednesday, December 10, 2025, after market close. The company will host a conference call at 2:00 p.m. Pacific Time / 5:00 p.m. Eastern Time to review its financial results and business outlook. Continue Reading Synopsys headquarters in Sunnyvale, Calif. (PRNewsfoto/Synopsys, Inc.) Also from this source Syn ...