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EpimAb Biotherapeutics Inc. - B(H0224) - OC Announcement - Appointment
2025-12-18 00:00
The Stock Exchange of Hong Kong Limited and the Securities and Futures Commission take no responsibility for the contents of this announcement, make no representation as to its accuracy or completeness and expressly disclaim any liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the contents of this announcement. EpimAb Biotherapeutics Inc. 岸邁生物科技有限公司 (Incorporated in the Cayman Islands with limited liability) WARNING The publication of this announcement is ...
COREE Company Limited(H0225) - Application Proof (1st submission)
2025-12-18 00:00
The Stock Exchange of Hong Kong Limited and the Securities and Futures Commission take no responsibility for the contents of this Application Proof, make no representation as to its accuracy or completeness and expressly disclaim any liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the contents of this Application Proof. Application Proof of COREE Company Limited 科酈有限公司 (the "Company") (Incorporated in Hong Kong with limited liability) WARNING The publica ...
EpimAb Biotherapeutics Inc. - B(H0224) - Application Proof (1st submission)
2025-12-18 00:00
The Stock Exchange of Hong Kong Limited and the Securities and Futures Commission take no responsibility for the contents of this Application Proof, make no representation as to its accuracy or completeness and expressly disclaim any liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the contents of this Application Proof. Application Proof of EpimAb Biotherapeutics Inc. 岸邁生物科技有限公司 (the "Company") (Incorporated in the Cayman Islands with limited liability) ...
COREE Company Limited(H0225) - OC Announcement - Appointment
2025-12-18 00:00
COREE Company Limited 科酈有限公司 The Stock Exchange of Hong Kong Limited and the Securities and Futures Commission take no responsibility for the contents of this announcement, make no representation as to its accuracy or completeness and expressly disclaim any liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the contents of this announcement. or delivered, directly or indirectly, into or within the United States, except pursuant to an exemption from, or in a ...
USAS Building System (Shanghai) Co., Ltd.(02671) - PHIP (1st submission)
2025-12-17 00:00
The Stock Exchange of Hong Kong Limited and the Securities and Futures Commission take no responsibility for the contents of this Post Hearing Information Pack, make no representation as to its accuracy or completeness and expressly disclaim any liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the contents of this Post Hearing Information Pack. Post Hearing Information Pack of USAS Building System (Shanghai) Co., Ltd. 美 聯 鋼 結 構 建 築 系 統( 上 海 )股 份 有 限 公 司 ( ...
SKG Health Technologies Co., Ltd.(H0222) - Application Proof (1st submission)
2025-12-17 00:00
The Stock Exchange of Hong Kong Limited and the Securities and Futures Commission take no responsibility for the contents of this Application Proof, make no representation as to its accuracy or completeness and expressly disclaim any liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the contents of this Application Proof. Application Proof of SKG Health Technologies Co., Ltd. 未來穿戴健康科技股份有限公司 (A joint stock company established in the People's Republic of Chi ...
GigaDevice Semiconductor Inc.(H0221) - PHIP (1st submission)
2025-12-17 00:00
业绩总结 - 公司营收2022 - 2023年下降,2024 - 2025年上半年增长[79] - 公司毛利润2023年下降,2024 - 2025年上半年增长[79][81][82] - 公司毛利率2023年下降,2024 - 2025年上半年上升[79][81][82] - 公司净利润2023年下降,2024 - 2025年上半年增长[83] - 2025年前九个月公司收入、销售成本、毛利润、利润同比增长[121][122][123][129] - 2025年前九个月公司其他收入同比减少[124] - 2024 - 2025年前九个月研发费用占营收比例从15.0%降至12.6%[128] - 公司总资产2024 - 2025年9月30日增长,总负债下降,净资产增长[130] 用户数据 - 截至2025年10月31日四个月内,公司经销商数量从254家增至267家[117] 未来展望 - 文档包含前瞻性陈述,受风险、不确定性和假设影响[197] - 公司无义务更新或修订前瞻性陈述[200] 新产品和新技术研发 - MCU基于ARM®和RISC - V结构,有63个系列超700种产品[51] - 公司采用集成产品开发框架进行研发,注重内部核心IP研发和外部成熟许可IP采购[55] 市场扩张和并购 - 公司于2019年收购苏州福瑞思信息科技有限公司[178] 其他新策略 - 公司销售主要通过分销商,注重维护和拓展客户关系,销售团队参与产品研发[56][58] 市场份额数据 - 2024年NOR Flash全球市场份额18.5%,中国大陆排名第一[43] - 2024年SLC NAND Flash全球市场份额2.2%,中国大陆排名第一[43] - 2024年小众DRAM全球市场份额1.7%,中国大陆排名第二[43] - 2024年MCU全球市场份额1.2%,中国大陆排名第一[43] - 2024年指纹传感器芯片中国大陆市场份额约10%,排名第二[43] 客户与供应商数据 - 2022 - 2024年及2025年上半年,五大客户销售额及占比有变化[59] - 2022 - 2024年及2025年上半年,最大客户销售额及占比有变化[59] - 2022 - 2024年及2025年上半年,五大供应商采购额及占比有变化[61] - 2022 - 2024年及2025年上半年,最大供应商采购额及占比有变化[61] H股发售信息 - 认购H股申请人可能需按申请渠道支付相关费用,若最终定价低于最高价格可获退还[16] - 整体协调人可减少发售股份数目及/或指示性价格范围[17] - H股名义价值为每股人民币1.00元[13] - 最高发售价为每股H股HK$[REDACTED],另加相关费用[13] - 预计定价将由整体协调人与公司协定,不超过每股HK$[REDACTED],目前预计不低于每股HK$[REDACTED][15] - 若特定情况出现,整体协调人可终止[REDACTED]下责任[18] - H股未且不会根据美国证券法或美国州证券法注册,不得在美国境内或向美国人士发售等[19] 财务指标数据 - 2022 - 2025年部分时期营收、销售成本、毛利润、经营利润、税前利润、净利润、调整后净利润及占比有数据记录[67][70] - 2022 - 2025年部分时期调整后净利润率分别为27.7%、4.5%、17.1%、16.1%、16.2%[70] - 截至2022 - 2025年6月30日,非流动资产、流动资产有数据[84] - 公司净资产2022 - 2025年6月30日有数据及变化原因[87] - 2022 - 2025年6月30日,经营、投资、融资活动净现金有数据[90] - 2022 - 2025年6月30日,毛利率、利润率、调整后净利润率、流动比率有数据[93] - 公司A股市值基于相关数据计算为154,047.5百万港元[101][109] - 2022 - 2024年和2025年上半年,公司分别宣派并批准末期股息有数据[112] - 截至2025年10月31日十个月,特种存储芯片、MCU平均售价下降[118] - 2025年前九个月公司销售及分销开支、行政开支同比增长[125][127] - 2025年前九个月公司经营、投资、融资活动净现金流有数据[131] 公司相关信息 - 公司有2020、2021、2023、2024年股票期权激励计划及2021年限制性股票激励计划[176] - 合肥石溪兆易创智创业投资基金合伙企业是矽成半导体股东[178] - 珠海横琴芯存半导体有限公司是公司全资子公司[181] - 苏州赛芯电子科技有限公司是公司非全资子公司[181] - 截至2025年12月10日,公司持有的603,020股回购A股已计入已发行股份总数[181] - 业绩记录期为2022、2023、2024财年及截至2025年6月30日的六个月[178] - 《境外证券发行和上市管理试行办法》于2023年2月17日颁布,3月31日生效[171] - 公司股份每股面值为人民币1.00元[176]
Shanghai Biren Technology Co., Ltd.(H0220) - PHIP (1st submission)
2025-12-17 00:00
Hong Kong Exchanges and Clearing Limited, The Stock Exchange of Hong Kong Limited and the Securities and Futures Commission take no responsibility for the contents of this Post Hearing Information Pack, make no representation as to its accuracy or completeness and expressly disclaim any liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the contents of this Post Hearing Information Pack. Post Hearing Information Pack of Shanghai Biren Technology Co., Ltd. 上 ...
SKG Health Technologies Co., Ltd.(H0222) - OC Announcement - Appointment
2025-12-17 00:00
The Stock Exchange of Hong Kong Limited and the Securities and Futures Commission take no responsibility for the contents of this announcement, make no representation as to its accuracy or completeness and expressly disclaim any liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the contents of this announcement. SKG Health Technologies Co., Ltd. 未來穿戴健康科技股份有限公 司 (A joint stock company incorporated in the People's Republic of China with limited liability) WA ...
BANU INTERNATIONAL HOLDING LTD(H0219) - OC Announcement - Appointment
2025-12-17 00:00
The Stock Exchange of Hong Kong Limited and the Securities and Futures Commission take no responsibility for the contents of this announcement, make no representation as to its accuracy or completeness and expressly disclaim any liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the contents of this announcement. BANU INTERNATIONAL HOLDING LTD No offer or invitation will be made to the public in Hong Kong until after a prospectus of the Company has been reg ...