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半导体封装行业更新-Semiconductor packaging industry update
2026-08-24 10:25
Packaging substrate shipments up 98% y-y Rise in price per m² drives growth in shipments; tight supply–demand conditions for high- end package substrates unlikely to ease any time soon Packaging-related monthly statistics: Record-high shipments in June According to the Current Survey of Production for June, released on 17 August, shipments of packaging substrates (rigid module substrates) rose 98% y-y to ¥29.1bn, surpassing the previous record high of ¥27.8bn set in May. Shipments on a m² basis rose 20% and ...